All Copper Is Not Created Equal – Examples of Grain Engineering in Plating-Reference-Cited by-同舟云学术

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All Copper Is Not Created Equal – Examples of Grain Engineering in Plating

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Zhang Yun¹,Wang Jing¹,Dong Peipei¹,Zhang Xingxing¹,Zhao Wei¹,Liang Josh¹,Herkommer Michael²,Leyendecker Klaus²,Wohlfarth Volker²

Affiliation:

1. Shinhao Materials LLC,Suzhou,RPC

2. Umicore Metal Deposition Solutions,Schwaebisch Gmuend,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816481.pdf?arnumber=9816481

Reference18 articles.

1. Self-annealing characterization of electroplated copper films

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research progress of hybrid bonding technology for three-dimensional integration;Microelectronics Reliability;2024-04

2. All Nanograined Copper Is Not Created Equal;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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