Self-annealing characterization of electroplated copper films-Reference-Cited by-同舟云学术

Self-annealing characterization of electroplated copper films

Published:2000-01 Issue:1-4 Volume:50 Page:449-457
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Lagrange S,Brongersma S.H,Judelewicz M,Saerens A,Vervoort I,Richard E,Palmans R,Maex K

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. T. Ritzdorf, L. Graham, S. Jin, C. Mu, D. Fraser, Proc. Int. Interconnect Technol. Conf., 1998, p. 166.

2. C. Cabral Jr., P.C. Andricacos, L. Gignac, I.C. Noyan, K.P. Rodbell, T.M. Shaw, R. Rosenberg, J.M.E. Harper, P.W. DeHaven, P.S. Locke, S. Malhotra, C. Uzoh, S.J. Klepeis, Adv. Metallization Conf., Colorado Spring, CO, Oct. 1998.

3. Q.T. Jiang, R. Mikkola, B. Carpenter, M.E. Thomas, Adv. Metallization Conf. Colorado Spring, CO, Oct. 1998.

4. Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. Microhardness in relationship to coating structure;Stoychev;J. Appl. Electrochem.,1985

5. B.M. Hogan, Microstructural stability of copper electroplate, AESF Conference–SURF/FIN’84.

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