Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. I. Microhardness in relation to coating structure-Reference-Cited by-同舟云学术

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Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. I. Microhardness in relation to coating structure

Published:1985-11 Issue:6 Volume:15 Page:879-886
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Stoychev D. S.,Tomov I. V.,Vitanova I. B.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF00614363.pdf

Reference22 articles.

1. A. Sieverts and W. Wippelmann,Z. anorg. Chem. 91 (1915) 1.

2. A. Butts and V. De Nora,Trans. Electrochem. Soc. 79 (1941) 22.

3. N. P. Fedotiev and P. M. Viatcheslavov,Trudi LTI im. Lensoveta,53 (1959) 9.

4. N. P. Fedotiev, P. M. Viatchelslavov, V. I. Gribel and E. M. Zaleskaya,J. Appl. Chem. (USSR)37 (1964) 691.

5. K. Schmidt and K. I. Tihonov,J. Appl. Chem. (USSR)44 (1971) 1896.

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