Room Temperature Softening of Electrodeposited Copper Films-Reference-Cited by-同舟云学术

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Room Temperature Softening of Electrodeposited Copper Films

Published:2014 Issue:3 Volume:65 Page:129-134
ISSN:0915-1869
Container-title:Journal of the Surface Finishing Society of Japan
language:en
Short-container-title:Journal of The Surface Finishing Society of Japan

Author:

NAWAFUNE Hidemi¹

Affiliation:

1. Frontiers of Innovative Research in Science and Technology, Konan University

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Reference11 articles.

1. 1) O. Kardos ; US PAT. 725209 (1968).

2. 2) IBM. Comm. ; 5, Spring (1998).

3. 3) D. Stoychev, I. Tomov, I. Vitanova ; J. Applied Electrochem., 15, 879 (1975).

4. 4) Von G. Micheal ; Metaloberflӓche, 32, 430 (1978).

5. 5) Ch. J. Raup ; Plat. and Surf. Finish., 80, (9), 30 (1993).

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of Hydrogen on Room-Temperature Grain Growth of Electrodeposited Cu Films;Journal of the Japan Institute of Metals;2016

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