X-ray diffraction pole figure evidence for (111) sidewall texture of electroplated Cu in submicron damascene trenches
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.122986
Reference10 articles.
1. Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films
2. Correlation of texture with electromigration behavior in Al metallization
3. Blanket and Local Crystallographic Texture Determination in Layered Al Metallization
4. Linewidth and underlayer influence on texture in submicrometer-wide Al and AlCu lines
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