Blanket and Local Crystallographic Texture Determination in Layered Al Metallization

Abstract

AbstractThe effect of microstructure, including average grain size, grain size distribution, precipitate distribution and crystallographic texture, on the reliability of Al and Al-alloys is well documented. In this paper, the various x-ray methods available for measuring preferred orientation in blanket films are compared and contrasted in an effort to find the fastest, most accurate method to acquire crystallographic texture information. I(111)/I(200)ratios from Bragg-Brentano scans (θ/2θ), rocking curves, and complete pole figures (fiber plots) were compared for four Ti/AlCu films having greatly different crystallographic texture components. The results show that it matters how texture is measured in a thin film; only pole figures (fiber plots) are unambiguous. In addition, the local texture in a series of stress-voided 0.48 um wide Ti/AICuSi/TiN lines was measured using Backscattered Kikuchi Diffraction (BKD). Samples were chosen from two sets of identically prepared wafers (processed at different times) showing large differences in stress-voiding driven resistance versus time behavior. The more strongly textured (111 ) films had decreased stress-voiding lifetimes and tended to have smaller average grain sizes with slightly larger grain size distributions. This is in apparent contradiction with previous results in Al films, where improved stress-voiding and electromigration behavior were found in those films with the strongest (111 ) texture.