Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by
19 articles.
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1. Texture and electromigration performance in damascene interconnects formed by reflow sputtered Cu film;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2004
2. Texture enhancement of Al films on Ti underlayers by radio-frequency bias sputtering;Journal of Electronic Materials;2002-10
3. Effect of the Ti-underlayer microstructure on the texture of Al thin films;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2001
4. Al–Cu Texture Enhancement by Underlayer Texture;Japanese Journal of Applied Physics;1998-12-15
5. Development of texture in interconnect thin film stacks;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1998-09