On the prediction of electromigration voiding using stress-based modeling
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.372452
Reference15 articles.
1. Electromigration in thin aluminum films on titanium nitride
2. Electromigration in thin aluminum films on titanium nitride
3. Stress evolution due to electromigration in confined metal lines
4. A model for electromigration behaviour in terms of flux divergences
5. Stress distribution and mass transport along grain boundaries during steady-state electromigration
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