A model for electromigration behaviour in terms of flux divergences-Reference-Cited by-同舟云学术

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A model for electromigration behaviour in terms of flux divergences

Published:1987-08 Issue:8 Volume:21 Page:1077-1082
ISSN:0036-9748
Container-title:Scripta Metallurgica
language:en
Short-container-title:Scripta Metallurgica

Author:

Ross C.A.,Evetts J.E.

Publisher

Elsevier BV

Subject

General Engineering

Reference20 articles.

1. Electromigration in thin films, Chapter 8 of Thin Films -Interdiffusion and Reactions;d'Heurle,1978

2. Electromigration in thin gold films on molybdenum surfaces

3. Electromigration in thin aluminum films on titanium nitride

4. Erratum: Electromigration in thin aluminum films on titanium nitride

5. The threshold current density and incubation time to electromigration in gold films

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Materials and Processes;SPRINGER-PRAX BOOKS;2016

2. Dielectric cracking produced by electromigration in microelectronic interconnects;Journal of Applied Physics;2000-12

3. On the prediction of electromigration voiding using stress-based modeling;Journal of Applied Physics;2000-04-15

4. Threshold stress behavior in thin film electromigration;Journal of Applied Physics;1999-06-15

5. Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction;Applied Physics Letters;1998-03-16

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