Dielectric cracking produced by electromigration in microelectronic interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1289044
Reference25 articles.
1. Stress generation by electromigration
2. Electromigration in thin aluminum films on titanium nitride
3. Stable state of interconnect under temperature change and electric current
4. Microfracture in brittle solids resulting from anisotropic shape changes
5. Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
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