Influence of local thermal dissipation on electromigration in an Al thin-film line-Reference-Cited by-同舟云学术

Influence of local thermal dissipation on electromigration in an Al thin-film line

Published:2016-10 Issue: Volume:65 Page:178-183
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Li Yuan,Lee Hsin-Tzu,Saka Masumi

Funder

Japan Society for the Promotion of Science

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

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2. Recent advances on electromigration in very-large-scale-integration of interconnects;Tu;J. Appl. Phys.,2003

3. Electromigration in ULSI interconnects;Tan;Mater. Sci. Eng. R,2007

4. Current-induced marker motion in gold wires;Huntington;J. Phys. Chem. Solids,1961

5. Electromigration: a review;Pierce;Microelectron. Reliab.,1997

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