Interconnect reliability analysis of ULSI using automated model generation algorithm-Reference-Cited by-同舟云学术

Interconnect reliability analysis of ULSI using automated model generation algorithm

Published:2016-03-17 Issue:6 Volume:26 Page:481-488
ISSN:1096-4290
Container-title:International Journal of RF and Microwave Computer-Aided Engineering
language:en
Short-container-title:Int J RF and Microwave Comp Aid Eng

Author:

Lin Qian¹²,Fu Haipeng¹,Na Weicong¹,He Feifei³,Li Xi¹,Cheng Qianfu¹,Zhu Yuanyuan¹

Affiliation:

1. College of Electronic Information Engineering; Tianjin University; 300072 China

2. College of Physics and Electronic Information Engineer; Qinghai University for Nationalities; 810007 China

3. Globalfoundries; Singapore 639798

Funder

China Academy of Engineering Physics THz Science and Technology Foundation

863 Program of China

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/mmce.20992/fullpdf

Reference31 articles.

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3. Electromigration in ULSI interconnects;Tan;Mater Sci Eng R Rep,2007

4. Electromigration of copper in Al (0.25 at. % Cu) conductor lines;Kao;Appl Phys,2001

5. Statistical Analysis of Electromigration Lifetimes and Void Evolution in Cu Interconnects;Hauschildt;Appl Phys,2007

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