Statistical analysis of electromigration lifetimes and void evolution
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2655531
Reference20 articles.
1. Proceedings of IEEE International Interconnect Technology Conference;Hu C.-K.,1999
2. Electromigration in Cu interconnects with very different grain structures
3. Electromigration reliability issues in dual-damascene Cu interconnections
4. In situstudy of void growth kinetics in electroplated Cu lines
5. In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures
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