Non‐linear resistance behavior in the early stages and after electromigration in Al‐Si lines
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.363552
Reference22 articles.
1. Interaction between electromigration and mechanical-stress-induced migration; New insights by a simple, wafer-level resistometric technique
2. Electromigration Induced Resistance Changes in Passivated Aluminum Thin Film Conductors
3. Critical Review of 1-Particle Models in Electromigration Resistance Change Modeling
4. The Influence of Thermal-Mechanical Effectson Resistance Changes During and After Electromigration Experiments
5. Non-Destructive Electrical Techniques as Means for Understanding the Basic Mechanisms of Electromigration
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1. A percolative approach to investigate electromigration failure in printed Ag structures;Journal of Applied Physics;2016-09-28
2. Tensile strain and resistance variation caused by torsional deformation in dilute Al-Mg alloys;Journal of Physics: Conference Series;2009-01-01
3. Biased resistor network model for electromigration failure and related phenomena in metallic lines;Physical Review B;2004-11-19
4. Investigation of the role of compositional effects on electromigration damage of metallic interconnects;Computational Materials Science;2001-11
5. A percolative approach to electromigration in metallic lines;Journal of Physics D: Applied Physics;2001-04-18
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