Author:
Möckl U.E.,Lloyd J.R.,Arzt E.
Abstract
AbstractThe relative change in resistance due to electromigration was studied in thin (0.7 μm) film conductors of AI-0.5% Cu Alloy passivated with a 1 μm thick glass passivation using a sensitive AC bridge technique. In contrast to previous experiments performed on unpassivated structures where a roughly linear resistance increase was observed, a saturation value for the resistance increase was observed which was seen to be a function of temperature and the applied current density. The results were found to be consistent with a Shatzkes and Lloyd electromigration model.
Publisher
Springer Science and Business Media LLC
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