Numerical investigations of the electromigration boundary value problem
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.351204
Reference10 articles.
1. A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2
2. Electromigration in thin aluminum films on titanium nitride
3. Stress generation by electromigration
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