Physics-Based EM Modeling
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-26172-6_2
Reference65 articles.
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3. S.M. Alam, C.L. Gan, C.V. Thompson, D.E. Troxel, Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations. Microelectron. J. 38(4–5), 463–473 (2007). http://dx.doi.org/10.1016/j.mejo.2006.11.017
4. J.R. Black, Electromigration-a brief survey and some recent results. IEEE Trans. Electron Devices 16(4), 338–347 (1969)
5. I.A. Blech, Electromigration in thin aluminum films on titanium nitride. J. Appl. Phys. 47(4), 1203–1208 (1976)
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