Ultrasound holography for noninvasive imaging of buried defects and interfaces for advanced interconnect architectures-Reference-Cited by-同舟云学术

Ultrasound holography for noninvasive imaging of buried defects and interfaces for advanced interconnect architectures

Published:2009-12-28 Issue:26 Volume:95 Page:263101
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Shekhawat Gajendra,Srivastava Arvind,Avasthy Shraddha,Dravid Vinayak

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.3263716

Reference30 articles.

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5. Fatigue of damascene copper lines under cyclic electrical loading

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