Impact of oxygen plasma postoxidation process on Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor capacitors
Author:
Affiliation:
1. Institute of Electronics, Microelectronics and Nanotechnology, University of Lille 1, CNRS UMR 8520, Avenue Henri Poincaré, 59652 Villeneuve d'Ascq, France
Funder
Agence Nationale de la Recherche (ANR)
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4963656
Reference30 articles.
1. Submicrometer Inversion-Type Enhancement-Mode InGaAs MOSFET With Atomic-Layer-Deposited $\hbox{Al}_{2}\hbox{O}_{3}$ as Gate Dielectric
2. Addressing the gate stack challenge for high mobility InxGa1-xAs channels for NFETs
3. High-performance self-aligned inversion-channel In0.53Ga0.47As metal-oxide-semiconductor field-effect-transistors by in-situ atomic-layer-deposited HfO2
4. Impact of weak Fermi-level pinning on the correct interpretation of III-V MOS C-V and G-V characteristics
5. Defect state passivation at III-V oxide interfaces for complementary metal–oxide–semiconductor devices
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