Low resistivity copper germanide on (100) Si for contacts and interconnections
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.117245
Reference11 articles.
1. A copper/polyimide Metal-base packaging technology
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4. Oxidation of Cu and Cu3Ge thin films
5. Titanium Silicides and their Technological Applications
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