A copper/polyimide Metal-base packaging technology-Reference-Cited by-同舟云学术

A copper/polyimide Metal-base packaging technology

Published:1989-03 Issue:2 Volume:18 Page:319-326
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Takasago Hayato,Adachi Kohei,Takada Mitsuyuki

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02657424.pdf

Reference3 articles.

1. H. Takasago,et al. IEEE CHMT, Vol. CHMT-10, 425 (1987).

2. H. Takasago,et al. “Fine-line, multilayer hybrids with wet-processed conductors and thick-film resistors,“ Proc. 34th Electronic Components Conf., 1984, pp. 324-329.

3. Adachi,et al. “High Density Metal Base Substrate Technology for LSIs,“ Proc. Printed Circuit World Convention, June, 1987.

Cited by 48 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Synthesis and recognition behavior studies of indole derivatives;Inorganic Chemistry Communications;2022-11

2. Polymer link breakage of polyimide-film-surface using hydrolysis reaction accelerator for enhancing chemical–mechanical-planarization polishing-rate;Scientific Reports;2022-03-01

3. BODIPY-based hydroxypyridyl derivative as a highly Ni2+-selective fluorescent chemosensor;Journal of Molecular Structure;2021-12

4. Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding;Scientific Reports;2018-07-13

5. Natural Oxidation of Ultra-Thin Copper Films;Russian Physics Journal;2018-01