Methods for improving electromechanical coupling coefficient in two dimensional electric field excited AlN Lamb wave resonators
Author:
Affiliation:
1. Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR), 11 Science Park Road, Science Park II, Singapore 117685
Funder
Institute Of Microelectronics - A STAR (IME)
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4923207
Reference24 articles.
1. Environmental Monitoring by Wireless Communication Networks
2. Bulk acoustic wave RF technology
3. AlN/3C-SiC Composite Plate Enabling High-Frequency and High-Q Micromechanical Resonators
4. Enhancement of Piezoelectric Response in Scandium Aluminum Nitride Alloy Thin Films Prepared by Dual Reactive Cosputtering
5. Lithium tantalate SAW substrate minimal diffraction cuts
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