Flexible and wearable acoustic wave technologies

Author:

Zhou Jian1ORCID,Guo Yihao1ORCID,Wang Yong23ORCID,Ji Zhangbin1ORCID,Zhang Qian23ORCID,Zhuo Fenglin1ORCID,Luo Jingting4ORCID,Tao Ran34ORCID,Xie Jin2ORCID,Reboud Julien5ORCID,McHale Glen6ORCID,Dong Shurong7ORCID,Luo Jikui7ORCID,Duan Huigao18ORCID,Fu Yongqing23ORCID

Affiliation:

1. College of Mechanical and Vehicle Engineering, Hunan University 1 , Changsha 410082, China

2. The State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University 2 , Hangzhou 310027, China

3. Faculty of Engineering and Environment, Northumbria University 3 , Newcastle upon Tyne NE1 8ST, United Kingdom

4. Shenzhen Key Laboratory of Advanced Thin Films and Applications, College of Physics and Energy, Shenzhen University 4 , 518060 Shenzhen, China

5. Division of Biomedical Engineering, School of Engineering, University of Glasgow 5 , Glasgow G12 8LT, United Kingdom

6. Institute of Multiscale Thermofluids, School of Engineering, University of Edinburgh 6 , Kings Building, Edinburgh EH9 3FB, United Kingdom

7. College of Information Science and Electronic Engineering, Zhejiang University 7 , Hangzhou 310027, China

8. Greater Bay Area Institute for Innovation, Hunan University 8 , Guangzhou 511300, China

Abstract

Flexible and wearable acoustic wave technology has recently attracted tremendous attention due to their wide-range applications in wearable electronics, sensing, acoustofluidics, and lab-on-a-chip, attributed to its advantages such as low power consumption, small size, easy fabrication, and passive/wireless capabilities. Great effort has recently been made in technology development, fabrication, and characterization of rationally designed structures for next-generation acoustic wave based flexible electronics. Herein, advances in fundamental principles, design, fabrication, and applications of flexible and wearable acoustic wave devices are reviewed. Challenges in material selections (including both flexible substrate and piezoelectric film) and structural designs for high-performance flexible and wearable acoustic wave devices are discussed. Recent advances in fabrication strategies, wave mode theory, working mechanisms, bending behavior, and performance/evaluation are reviewed. Key applications in wearable and flexible sensors and acoustofluidics, as well as lab-on-a-chip systems, are discussed. Finally, major challenges and future perspectives in this field are highlighted.

Funder

National Natural Science Foundation of China

National Natural Science Foundation of China-Zhejiang Joint Fund for the Integration of Industrialization and Informatization

Publisher

AIP Publishing

Subject

General Physics and Astronomy

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