Three-dimensional measurements of fundamental plasma parameters in pulsed ICP operation
Author:
Affiliation:
1. University of California, Los Angeles, California 90024, USA
2. Lam Research Corp, Fremont, California 90024, USA
Funder
U.S. Department of Energy
Division of Physics
Publisher
AIP Publishing
Subject
Condensed Matter Physics
Link
http://aip.scitation.org/doi/am-pdf/10.1063/5.0007288
Reference40 articles.
1. Pulsed high-density plasmas for advanced dry etching processes
2. Effect of Power Modulation on Radical Concentration and Uniformity in a Single-Wafer Plasma Reactor
3. Diagnostics and control of radicals in an inductively coupled etching reactor
4. Reduction of plasma induced damage in an inductively coupled plasma using pulsed source power
5. Pulsed inductively coupled plasmas as a method to recoup uniformity: Three-dimensional modeling study
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