Reduction in resistivity of 50 nm wide Cu wire by high heating rate and short time annealing utilizing misorientation energy
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3474663
Reference10 articles.
1. Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces
2. Resistivity Increase in Ultrafine-Line Copper Conductor for ULSIs
3. Size-dependent resistivity of metallic wires in the mesoscopic range
4. Processing technology for the investigation of sub-50 nm copper damascene interconnects
5. Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects
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