Analysis of the electronic and chemical structure in boron and phosphorus passivated 4H-SiC/SiO2 interfaces using HRTEM and STEM-EELS
Author:
Affiliation:
1. Department of Materials Science and Engineering, University of Maryland, College Park, Maryland 20742, USA
2. Department of Physics, Auburn University, Auburn, Alabama 36849, USA
3. US Army Research Laboratory, Adelphi, Maryland 20783, USA
Funder
National Science Foundation
Army Research Laboratory
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5053595
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1. Thermal transport mechanism of 4H–SiC/SiO2 heterostructures: a molecular dynamics study;Physica Scripta;2023-12-26
2. Boron and barium incorporation at the 4H-SiC/SiO2 interface using a laser multi-charged ion source;Journal of Materials Science: Materials in Electronics;2021-05-17
3. Bias temperature instability in SiC metal oxide semiconductor devices;Journal of Physics D: Applied Physics;2021-01-19
4. Interstitial boron-doped mesoporous semiconductor oxides for ultratransparent energy storage;Nature Communications;2021-01-19
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