Precise ion energy control with tailored waveform biasing for atomic scale processing-Reference-Cited by-同舟云学术

Precise ion energy control with tailored waveform biasing for atomic scale processing

Published:2020-12-07 Issue:21 Volume:128 Page:213301
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Faraz Tahsin¹^ORCID,Verstappen Yuri G. P.¹,Verheijen Marcel A.¹²^ORCID,Chittock Nicholas J.¹^ORCID,Lopez Javier Escandon³,Heijdra Erik³,van Gennip Wouter J. H.³,Kessels Wilhelmus M. M.¹^ORCID,Mackus Adriaan J. M.¹^ORCID

Affiliation:

1. Department of Applied Physics, Eindhoven University of Technology, P. O. Box 513, 5600 MB Eindhoven, The Netherlands

2. Eurofins Materials Science Netherlands, High Tech Campus 11, 5656 AE Eindhoven, The Netherlands

3. Prodrive Technologies B.V., Science Park Eindhoven 5501, 5692 EM Son, The Netherlands

Funder

Nederlandse Organisatie voor Wetenschappelijk Onderzoek

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/5.0028033

Reference58 articles.

1. The era of hyper-scaling in electronics

2. Perspective: New process technologies required for future devices and scaling

3. Atomic Layer Etching: Rethinking the Art of Etch

4. Atomic Layer Etching: What Can We Learn from Atomic Layer Deposition?

5. Principles of Plasma Discharges and Materials Processing

Cited by 35 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A New High-Power Density Tailored Waveform Modulator for Plasma Processing;IEEE Transactions on Industrial Electronics;2024-11

2. Characteristics of clean SiO2 atomic layer etching based on C6F6 physisorption;Applied Surface Science;2024-10

3. In situ measurement of electron emission yield at Si and SiO₂ surfaces exposed to Ar/CF₄ plasmas;Plasma Sources Science and Technology;2024-08-01

4. Energy efficient F atom generation and control in CF₄ capacitively coupled plasmas driven by tailored voltage waveforms;Plasma Sources Science and Technology;2024-08-01

5. Enhancing sp3 formation in DLC on low thermal conductivity substrate: Interval deposition minimizing ion energy sensitivity;Diamond and Related Materials;2024-08