Time- and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with Pd/Ni and Au/Pd/Ni thin films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.368136
Reference41 articles.
1. Palladium as a lead finish for surface mount integrated circuit packages
2. Analysis of the reaction between 60Sn-40Pb solder with a Pd-Pt-Ag-Cu-Au alloy
3. Thin‐film reactions of Pb with AgAu and AgPd alloys
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