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TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system

  • Published:2017-10 Issue: Volume:706 Page:269-278
  • ISSN:0921-5093
  • Container-title:Materials Science and Engineering: A
  • language:en
  • Short-container-title:Materials Science and Engineering: A

Author:

Ho C.E.,Lu M.K.,Lee P.T.,Huang Y.H.,Chou W.L.

Funder

Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference33 articles.

1. Tin-lead (SnPb) solder reaction in flip chip technology;Tu;Mater. Sci. Eng.,2001

2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng.,2002

3. Interfacial reactions between lead-free solders and common base materials;Laurila;Mater. Sci. Eng.,2005

4. Interfacial reaction issues for lead-free electronic solders;Ho;J. Mater. Sci.: Mater. Electron.,2007

5. Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders;Chen;J. Mater. Res.,2002
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