Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy-Reference-Cited by-同舟云学术

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Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy

Published:2019-01 Issue: Volume:358 Page:753-761
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Huang Y.H.,Hsieh W.Z.,Lee P.T.,Wu Y.S.,Kuo T.T.,Ho C.E.

Funder

Ministerio de Ciencia y Tecnología

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference31 articles.

1. Surface finish effects on high-speed signal degradation;Wu;IEEE Trans. Adv. Packag.,2008

2. Development and evaluation of direct deposition of Au/Pd(P) bilayers over Cu pads in soldering applications;Ho;J. Electron. Mater.,2012

3. High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes;Ho;Appl. Surf. Sci.,2018

4. Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification;Huang;Corros. Sci.,2019

5. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering;Laurila;Mater. Sci. Eng. R,2010

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tin Multilayer‐Aided SAC305‐Based Lead‐Free Solder Joint Interface with Cu: An Investigation of the Stress Distribution by Finite Element Analysis and Nanoindentation Studies;Advanced Engineering Materials;2024-09-08

2. Reliability of micro-resistance welded dissimilar connection between Ag-plated Kovar foil and GaAs space solar cell: Processing, microstructure and bonding strength;Materials Today Communications;2024-06

3. Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study;Surface and Coatings Technology;2024-05

4. A Comparative Study on the Influence of SAC305 Lead‐Free Solder Sandwiched by Sn on the Micromechanical and Electrical Properties of the Joints;Advanced Engineering Materials;2021-08-26

5. IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique;Journal of Materials Research and Technology;2021-03

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