Room temperature wafer direct bonding of smooth Si surfaces recovered by Ne beam surface treatments
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4812742
Reference17 articles.
1. Wafer level packaging of MEMS
2. Hybrid Integrated Platforms for Silicon Photonics
3. One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration
4. Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS
5. Drift-Free Micromirror Arrays Made of Monocrystalline Silicon for Adaptive Optics Applications
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