High-quality InP/SOI heterogeneous material integration by room temperature surface-activated bonding for hybrid photonic devices-Reference-Cited by-同舟云学术

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High-quality InP/SOI heterogeneous material integration by room temperature surface-activated bonding for hybrid photonic devices

Published:2020-04-23 Issue:5 Volume:59 Page:052004
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Wang Yuning,Nagasaka Kumi,Mitarai Takuya,Ohiso Yoshitaka,Amemiya Tomohiro,Nishiyama Nobuhiko

Funder

New Energy and Industrial Technology Development Organization

Japan Science and Technology Agency

Japan Society for the Promotion of Science

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

https://iopscience.iop.org/article/10.35848/1347-4065/ab8434/pdf

Reference33 articles.

1. Integrated Optics: An Introduction

2. Optical Integrated Circuits: A Personal Perspective

3. III-V/silicon photonics for on-chip and intra-chip optical interconnects

4. Multichannel and high-density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for interchip optical interconnection

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1. Wafer-level InP-Si covalent bonding and defect-free heterointerface for photonic quantum systems;Applied Surface Science;2024-10

2. III–V gain region/Si waveguide hybrid lasers by chip-on-wafer hydrophilic bonding process using UV-ozone treatment;Japanese Journal of Applied Physics;2023-11-29

3. Room-Temperature Bonding of Indium Phosphide Wafers and Their Atomic Structure at the Bond Interface;ACS Applied Electronic Materials;2023-11-08

4. High thermal performance hybrid GaInAsP/SOI ridge waveguide lasers with enhanced heat dissipation structure;Japanese Journal of Applied Physics;2023-01-01

5. Low-thermal-resistance by Decoupled Ridge Insulation Structure for hybrid GaInAsP/SOI ridge-waveguide lasers;2022 28th International Semiconductor Laser Conference (ISLC);2022-10-16

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