Development of a fast atom beam gun for surface-activated bonding
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference21 articles.
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2. Surface activated room-temperature bonding in Ar gas ambient for MEMS encapsulation;Takagi;Jpn J Appl Phys,2018
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4. Room-temperature direct bonding of germanium wafers by surface-activated bonding method;Higurashi;Jpn J Appl Phys,2015
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Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Prototype of Parallel Plate Type Fast Atom Beam Source and its Improvement of Irradiation Characteristics;International Journal of Automation Technology;2024-07-05
2. New Long Life Fast Atom Beam Source for Surface Activated Bonding;2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D);2021-10-05
3. Particle-in-cell Monte Carlo collision simulation and experimental measurement of Ar plasma in a fast atom beam source for surface-activated bonding;Japanese Journal of Applied Physics;2021-03-02
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