Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2769270
Reference17 articles.
1. High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints
2. Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
3. Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration
4. Mechanical degradation of microelectronics solder joints under current stressing
5. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
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2. Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints;Journal of Materials Science: Materials in Electronics;2019-02-19
3. Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing;Electronic Materials Letters;2018-11-12
4. Stochastic Multi-Scale Reconstruction of 3D Microstructure Consisting of Polycrystalline Grains and Second-Phase Particles from 2D Micrographs;Metallurgical and Materials Transactions A;2015-12-28
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