Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing-Reference-Cited by-同舟云学术

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Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing

Published:2018-11-12 Issue:1 Volume:15 Page:36-48
ISSN:1738-8090
Container-title:Electronic Materials Letters
language:en
Short-container-title:Electron. Mater. Lett.

Author:

Wang Fengjiang,Chen Hong,Li Dongyang,Zhang Zhijie,Wang Xiaojing

Funder

National Natural Science Foundation of China

Science and Technology Support Program of Jiangsu Province

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s13391-018-00102-x/fulltext.html

Reference32 articles.

1. Piazza, R., Guarino, A.: Soret effect in interacting micellar solutions. Phys. Rev. Lett. 88, 208302 (2002)

2. Chen, C., Hsiao, H.-Y., Chang, Y.-W., Ouyang, F., Tu, K.N.: Thermomigration in solder joints. Mater. Sci. Eng., R 73, 85–100 (2012)

3. Huang, M.L., Yang, F., Zhao, N.: Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn–3.5Ag/Cu interconnects. Mater. Des. 89, 116–120 (2016)

4. Kunwar, A., Ma, H., Ma, H., Sun, J., Zhao, N., Huang, M.: On the increase of intermetallic compound’s thickness at the cold side in liquid Sn and SnAg solders under thermal gradient. Mater. Lett. 172, 211–215 (2016)

5. Zhao, N., Zhong, Y., Huang, M.L., Dong, W., Ma, H.T., Wang, Y.P.: In situ study on interfacial reactions of Cu/Sn–9Zn/Cu solder joints under temperature gradient. J Alloys Compd. 682, 1–6 (2016)

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