Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Chin, H.S., Cheong, K.Y., Ismail, A.B.: A review on die attach materials for SiC-based high-temperature power devices. Metall. Mater. Trans. B. 41B, 824–832 (2010)
2. Zhang, H., Chen, C., Jiu, J., Nagao, S., Suganuma, K.: High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device. J. Mater. Sci. : Mater. Electron. 29, 8854–8862 (2018)
3. Hong, W.S., Kim, M.S., Oh, C., Joo, Y., Kim, Y., Hong, K.-K.: Pressureless silver sintering of silicon-carbide power modules for electric vehicles. JOM. 72, 889–897 (2020)
4. Hong, W.S., Kim, M.S., Oh, C.: Low-pressure silver sintering of automobile power modules with a silicon-carbide device and an active-metal-brazed substrate. J. Electron. Mater. 49, 188–195 (2020)
5. Chen, T.F., Siow, K.S.: Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (ag) joints. J. Alloys Compd. 866, 158783 (2021)