Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints

Author:

Chen Tiam Foo,Siow Kim Shyong

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference195 articles.

1. Interfacial reactions and mechanical strength of Sn-3.0 Ag-0.5 Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications;Lee;Microelectron. Reliab.,2017

2. DA5 Die-attach material requirement specification. 〈https://www.infineon.com/dgdl/DA5_customer_presentation_1612016.pdf?fileId=5546d4616102d26701610905cfde0005&redirId=63139〉 (Accessed 20 Sept 2020).

3. Doctrine of equivalents and sintered silver (Ag) paste as bonding materials;Siow,2019

4. Are sintered silver joints ready for use as interconnect material in microelectronic packaging;Siow;J. Electron. Mater.,2014

5. Novel large area joining technique for improved power device performance;Schwarzbauer;IEEE,1989

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