Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4825323
Reference20 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples
3. Electromigration in Pb-free SnAg3.8Cu0.7 solder stripes
4. Theory of the driving force for electromigration
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