Author:
Hsu Ying-Chao,Chou Chung-Kwuang,Liu P. C.,Chen Chih,Yao D. J.,Chou T.,Tu K. N.
Subject
General Physics and Astronomy
Reference16 articles.
1. J. H. Lau and S.W. R. Lee,Chip Scale Package(McGraw-Hill, New York, 1999), p. 3.
2. S. Brandenburg and S. Yeh, Proceedings of Surface Mount International Conference and Exhibition, San Jose, CA, 23–27 August 1998 (Integrated Electronics Engineering Center, New York, 1998), p. 337.
3. Recent advances on electromigration in very-large-scale-integration of interconnects
4. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
5. The current status of lead-free solder alloys
Cited by
41 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献