Effect of conductivity on the electromigration-induced morphological evolution of islands with high symmetries of surface diffusional anisotropy-Reference-Cited by-同舟云学术

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Effect of conductivity on the electromigration-induced morphological evolution of islands with high symmetries of surface diffusional anisotropy

Published:2021-01-14 Issue:2 Volume:129 Page:025110
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Santoki Jay¹^ORCID,Mukherjee Arnab²,Schneider Daniel¹³^ORCID,Nestler Britta¹³

Affiliation:

1. Institute of Applied Materials (IAM-CMS), Karlsruhe Institute of Technology (KIT), Strasse am Forum 7, 76131 Karlsruhe, Germany

2. Center for Hierarchical Materials Design (CHiMaD), Northwestern University, 2205 Tech Drive, Evanston, Illinois 60208, USA

3. Institute of Digital Materials Science (IDM), Karlsruhe University of Applied Sciences, Moltkestrasse 30, 76133 Karlsruhe, Germany

Funder

polis

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/5.0033228

Reference62 articles.

1. A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion

2. The migration and coalescence of inert gas bubbles in metals

3. Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

4. Magnetic-field tuning of whispering gallery mode lasing from ferromagnetic nematic liquid crystal microdroplets

5. Electromigration-driven motion of an elliptical inclusion

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1. Phase-field simulation of conductive inclusion evolution in highly symmetric oriented single crystal metal interconnects under anisotropic interface diffusion induced by electromigration;Journal of Mechanics of Materials and Structures;2024-03-27

2. Phase-field modelling of electromigration-induced intergranular slit propagation in metal interconnects;Computational Materials Science;2023-09

3. Effect of electromigration on onset of morphological instability of a nanowire;Journal of Engineering Mathematics;2023-05-06

4. Finite element simulation of inclusion evolution in interconnects due to electromigration-induced interface diffusion;Archive of Applied Mechanics;2022-11-15

5. Finite-element simulation of a phase-field model for inclusion electromigration in {110}-oriented single crystal metal interconnects due to interface diffusion anisotropy;Applied Physics A;2022-06-27

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