A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion

Author:

Xia L.,Bower A.F.,Suo Z.,Shih C.F.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

Reference26 articles.

1. Electromigration failure by shape change of voids in bamboo lines;Arzt;J. Appl. Phys.,1994

2. Analysis of stress induced void growth mechanisms in passivated interconnect lines;Bower;J. Appl. Phys.,1993

3. Finite element analysis of electromigration and stress induced diffusion in deformable solids;Bower,1995

4. Automatic triangulation of arbitrary planar domains for the finite element method;Cavendish;Int. J. Num. Methods in Engng,1974

5. Stress singularities along a cycloid rough surface;Chiu;Int. J. Solids Struct.,1993

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