Operation of Schottky‐barrier field‐effect transistors of 3C‐SiC up to 400 °C

Author:

Daimon H.,Yamanaka M.,Shinohara M.,Sakuma E.,Misawa S.,Endo K.,Yoshida S.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Cited by 28 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices;Journal of Materials Science: Materials in Electronics;2013-04-21

2. Improvement in Joint Reliability of SiC Power Devices by a Diffusion Barrier Between Au-Ge Solder and Cu/Ni(P)-Metalized Ceramic Substrates;Journal of Electronic Materials;2011-05-17

3. Comparative study of transient current induced in SiC p+n and n+p diodes by heavy ion micro beams;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2009-06

4. Investigation of a Sic Module with a High Operating Temperature for Power Applications;2007 9th Electronics Packaging Technology Conference;2007-12

5. Characterization of charge generated in silicon carbide n+p diodes using transient ion beam-induced current;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2005-04

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