Probabilistic immortality of Cu damascene interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1436562
Reference14 articles.
1. Electromigration in thin aluminum films on titanium nitride
2. Stress generation by electromigration
3. Stable state of interconnect under temperature change and electric current
4. The effect of current density and stripe length on resistance saturation during electromigration testing
5. Electromigration saturation in a simple interconnect tree
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