Electromigration saturation in a simple interconnect tree
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1288019
Reference8 articles.
1. Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
2. Stress evolution due to electromigration in confined metal lines
3. Electromigration in thin aluminum films on titanium nitride
4. The effect of current density and stripe length on resistance saturation during electromigration testing
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1. Essential role of enhanced surface electron–phonon interactions on the electrical transport of suspended polycrystalline gold nanofilms;RSC Advances;2018
2. Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2016-11
3. Interconnect reliability modeling and analysis for multi-branch interconnect trees;Proceedings of the 52nd Annual Design Automation Conference;2015-06-07
4. Liquid-Phase Deposition of Freestanding Copper Foils and Supported Copper Thin Films and Their Structuring into Conducting Line Patterns;Angewandte Chemie International Edition;2012-04-05
5. Flüssigphasenabscheidung freistehender Kupferfolien und Kupferdünnfilme auf ein Substrat und deren Strukturierung zu Leiterbahnmustern;Angewandte Chemie;2012-04-05
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