Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees-Reference-Cited by-同舟云学术

Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees

Published:2016-11 Issue:11 Volume:35 Page:1811-1824
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Chen Hai-Bao,Tan Sheldon X.-D.,Huang Xin,Kim Taeyoung,Sukharev Valeriy

Funder

National Science Foundation

Semiconductor Research Corporation

Shanghai Jiao Tong University through the 985 Research Fund

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

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