Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2359135
Reference25 articles.
1. Current-crowding-induced electromigration failure in flip chip solder joints
2. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
3. Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples
4. Electromigration effects on compound growth at interfaces
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1. Effect of Sn Orientation on Electromigration Failure in CuSn Solders;Journal of Electronic Materials;2024-07-26
2. Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation;Applied Physics Letters;2023-12-04
3. A case study of intermetallic evolutions in a solder joint under electromigration using a novel experiment-simulation combined approach;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
4. Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review;Advanced Engineering Materials;2023-07-26
5. Coupling model of electromigration and experimental verification – Part I: Effect of atomic concentration gradient;Journal of the Mechanics and Physics of Solids;2023-05
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