A case study of intermetallic evolutions in a solder joint under electromigration using a novel experiment-simulation combined approach-Reference-Cited by-同舟云学术

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A case study of intermetallic evolutions in a solder joint under electromigration using a novel experiment-simulation combined approach

Published:2023-08-08 Issue: Volume: Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Yuan Haiyang¹,Li Ce¹,Ma Zhaolong²,Zhang Huizhe¹,Fan Mengzhuo¹

Affiliation:

1. Beijing Institute of Technology,School of Materials Science and Engineering,Beijing,China

2. Beijing Institute of Technology,School of Materials Science and Engineering National Key Laboratory of Science and Technology on Materials Under Shock and Impact Tangshan Research Institute,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492118.pdf?arnumber=10492118

Reference38 articles.

1. Recent advances on electromigration in very-large-scale-integration of interconnects

2. Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

3. Effect of contact metallization on electromigration reliability of Pb-free solder joints

4. Reliability challenges in 3D IC packaging technology

5. Interstitial Diffusion of Copper in Tin

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