Wave-shaped wires for the interconnection of silicon solar cells without pads or busbars-Reference-Cited by-同舟云学术

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Wave-shaped wires for the interconnection of silicon solar cells without pads or busbars

Published:2022 Issue: Volume: Page:
ISSN:0094-243X
Container-title:2ND INTERNATIONAL CONFERENCE ON EMERGING SMART MATERIALS IN APPLIED CHEMISTRY (ESMAC-2021): ESMAC-2021
language:
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Author:

Rendler Li Carlos,Pfreundt Andrea,Mittag Max,Kraft Achim,Neuhaus Dirk Holger

Publisher

AIP Publishing

Link

http://aip.scitation.org/doi/pdf/10.1063/5.0127402

Reference16 articles.

1. S. Wiese, R. Meier, and F. Kraemer, “Mechanical behaviour and fatigue of copper ribbons used as solar cell interconnectors,” in Proceedings of the 11th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, edited by Institute of Electrical and Electronics Engineers (2010), p. 1.

2. Linear thermal expansion measurements on silicon from 6 to 340 K

3. L. C. Rendler, A. Kraft, C. Ebert, S. Wiese, and U. Eitner, “Investigation of thermomechanical stress in solar cells with multi busbar interconnection by finite element modeling,” in Proceedings of the 32nd European Photovoltaic Solar Energy Conference and Exhibition (2016), p. 94.

4. Enabling the measurement of thermomechanical stress in solar cells and PV modules by confocal micro-Raman spectroscopy

5. Thermomechanical stress in solar cells: Contact pad modeling and reliability analysis

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wave-shaped wires for the interconnection of silicon solar cells without pads or busbars;2ND INTERNATIONAL CONFERENCE ON EMERGING SMART MATERIALS IN APPLIED CHEMISTRY (ESMAC-2021): ESMAC-2021;2022

2. Summary of the 10th workshop on metallization and interconnection for crystalline silicon solar cells;PROCEEDINGS OF THE 10TH WORKSHOP ON METALLIZATION AND INTERCONNECTION FOR CRYSTALLINE SILICON SOLAR CELLS;2022

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