Author:
Azmi M. A.,Abdullah M. K.,Abdullah M. Z.,Ariff Z. M.,Saad Abdullah Aziz,Hamid M. F.,Ismail M. A.
Reference9 articles.
1. R.Y. Chang, W.S. Yang, E. Chen, C. Lin, and C.H. Hsu, “On the Dynamics of Air Trap in the Encapsulation Process of Microelectronics Package,” Proc. ANTEC’ 98 Conf., pp 1178–1180, 1998.
2. Three-Dimensional Modeling of Mold Filling in Microelectronics Encapsulation Process
3. M. F. Hamid, M. K. Abdullah, H. Yusoff, and S. M. Firdaus, “Numerical Study of Mold Filling during Encapsulation Process,” Advance Material Research, Vol. 786, pp. 318–322, 2015.
4. V.M. Kulkarni, K.N. Seetharamu,I.A. Azid, P.A.A. Narayana, G.A. Quadir, “Numerical Simulation of Underfill Encapsulation Process Based on Characteristic Split Method”. Int J Numer Meth Eng, 66:1658–1671, 2006.
5. A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)
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