Molded underfill (MUF) encapsulation for flip-chip package: A numerical investigation

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Azmi M. A.,Abdullah M. K.,Abdullah M. Z.,Ariff Z. M.,Saad Abdullah Aziz,Hamid M. F.,Ismail M. A.

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Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Numerical Investigation on the Polymer Flow in a Restriction Flow Path;Springer Proceedings in Materials;2023

2. Parametric Study on the Void Risk in FC-POP Molded Underfill Process Using a Novel Porous Media, Two-Phase, Compressible Flow Simulation Method;IEEE Transactions on Device and Materials Reliability;2020-06

3. PCB Strip Scale Numerical Study on Vacuum Molded Underfill Void Entrapment in FC-POP Devices;2019 IEEE International Integrated Reliability Workshop (IIRW);2019-10

4. Injection molding;Encapsulation Technologies for Electronic Applications;2019

5. Flow Behavior Analysis of Emc in Molded Underfill (Muf) Encapsulation for Multi Flip-Chip Package;Journal of Physics: Conference Series;2018-08

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