1. Plastic Packaging of Microelectronic Device. Van Nostrand Reinhold: New York, 1990; 1–35.
2. Fundamentals of Microsystems Packaging. McGraw-Hill: New York, 2001.
3. On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound
4. Flow simulation in IC chip encapsulation. Electronic Component and Technology Conference, Buena Vista, 1994.
5. , . Flow and heat transfer during underfilling in flip chip electronic packages. XVII National and VI ISHMT/ASME Heat and Mass Transfer Conference, Chennai, India, 2004; 194–199.